OUR UNIQUE TECHNOLOGIES DELIVER UNMATCHED PERFORMANCE FOR
APPLICATIONS IN AEROSPACE, ELECTRONICS AND ELECTRIC AUTOMOTIVE SYSTEMS
APR uses a solid-state system to move thermal management fluids through cooling circuits, and induce convection on heat sources and heat sinks. The highly innovative functionality of this technology allows for several unique features that offer crucial advantages over conventional cooling technologies, such as:
- High efficiency – low power consumption
- Zero noise and vibration
- Maintenance-free, super reliable
- Robust in any environment
THE ELECTRONICS PRODUCT OFFERINGS
The technology opens for the introduction of all-new building blocks and design guidelines to solve thermal management of high-end components. As the technology utilizes dielectric working fluids, it is possible to employ direct-on-chip.
Dynamic Cooling – Beyond enabling forced convection directly against a chip die surface, the technology makes it possible to selectively direct this convection at specific hot spots on the die as and when they occur.
Ultra-Compact Liquid Cooling – The technology allows itself to be made almost arbitrarily small; compact enough to integrate into chip packages, or to make extremely low-profile cold plates to mount onto chip packages.
3D Processor Cooling – Due to the ultra-thin form factors achievable with this technology, locally forced convection is possible to achieve in immediate conjunction to 3D IC stacks, or even inside 3D packages.
APR Technologies is granted MSEK 2.5 from Vinnova for developing a compact and more efficient cooling system for electronics in the autonomous vehicle market.
APR Technologies is granted MSEK 2.5 from Vinnova for developing a compact and more efficient cooling system for electronics in the autonomous vehicle market. Together with Veoneer and Chalmers Industriteknik, the objective is to reduce the chip temperature and reach...
APR provides products based on innovative technology that enable new and smart thermal design of spacecraft.