Meet the APR team – Mikael Antelius

May 20, 2022 | Meet the APR team, News | 0 comments

Within our concept “Meet the APR team”, APR Technologies employees get to share their experiences, knowledge and trend research within their field of work.
Here you get to meet Mikael Antelius, Development engineer!

Hello Mikael, please tell us a little about yourself and your background.
– My name is Mikael Antelius and I have been working as a development engineer here at APR Technologies since 2014. When I started at APR we were only 4 people, which means that a lot has happened in the organization since then! I am an engineer in materials chemistry and have a PhD in microsystem technology, specifically the next generation of encapsulation of gas sensors and photonics. I have previously also worked as a process engineer at ÅAC Microtec, at the time when two of APR’s founders worked there.

Describe your field of work and your role at APR Technologies.
– As a development engineer, I am deeply involved in both the design and manufacture of our unique EHD pumps, as well as simulations of both the pump’s and the related systems’ performance. There we look at fluid flows, thermal performance and also mechanical responses. I develop and maintain our “digital twins”, where we can use our simulation tools to predict and understand how our thermal systems and pumps work and perform – at best even before we have even manufactured them. We bring all this understanding back into the products, which allow us to improve performance and economy.

What do you see as trends in your specific area right now? What will the development look like in the coming years?
– In recent years, we have seen an increasing need for better performing cooling solutions. When electronics become smaller and, not least, more power-dense, higher demands are placed on heat dissipation, both to be able to maintain high performance over time and to have an improved lifespan. In addition to this, there is an expectation to better predict thermal performance in more complicated geometries and cooling solutions.

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